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Progress in Chemistry 2023, Vol. 35 Issue (2): 233-246 DOI: 10.7536/PC220805 Previous Articles   Next Articles

• Review •

Surface Pretreatment of Polymer Electroless Plating for Electronic Applications

Xuexian Wu1, Yan Zhang1,2, Chunyi Ye1, Zhibin Zhang1, Jingli Luo1, Xianzhu Fu1()   

  1. 1 College of Materials Science and Engineering, Shenzhen University,Shenzhen 518055, China
    2 Pingshan Biomedical R&D Transformation Center, Shenzhen Bay Laboratory,Shenzhen 518118, China
  • Received: Revised: Online: Published:
  • Contact: *e-mail: xz.fu@szu.edu.cn
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Metallization of polymer surface plays an important role in conductive interconnect, electromagnetic shielding, thermal management, decoration and protection of electronic products. Compared with vacuum sputtering and other methods, electroless plating has advantages of uniform coating, low cost and easy large-scale production. In recent years, polymer used for electronic applications such as epoxy resin, polyimide (PI), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyurethane (PU), polystyrene (PS) have been actively studied. Coarsening treatment has obvious influence on the binding force of coating and the degree of coating on the substrate. At the same time, the activation method affects the speed and thickness of electroless plating. In the surface pretreatment of polymer electroless plating, coarsening and activation methods have a great influence on the coating properties, especially for LCP and other polymers that will be used in 5G equipment. In polymer electroless plating pretreatment, coarsening processes such as chemical etching, plasma treatment and graft treatment, as well as activation processes such as ion adsorption reduction, catalyst direct adsorption and ink printing also have many new developments. In this paper, the latest development of coarsening and activation pretreatment of various polymer substrates in electronic applications is summarized, in order to provide reference for the development of electroless plating technology for electronic circuits.

Contents

1 Introduction

2 Application of polymer electroless plating in electronic field

2.1 Mechanism of electroless plating

2.2 Conductive interconnect

2.3 Electromagnetic shielding

2.4 Heat management

3 Polymer surface coarsening method

3.1 Chemical etching

3.2 Plasma treatment

3.3 Grafting treatment

4 Activation method before polymer electroless plating

4.1 Catalyst metal ion adsorption and reduction

4.2 Direct catalyst adsorption

4.3 Direct ink writing and graphic printing

5 Polyimide (PI) pretreatment method for electroless plating

6 Polyethylene terephthalate (PET) pretreatment method for electroless plating

7 Polyurethane (PU) pretreatment method for electroless plating

8 Polydimethylaminosiloxane (PDMS) pretreatment method for electroless plating

9 Polystyrene (PS) pretreatment method for electroless plating

10 Polypropylene (PP) pretreatment method for electroless plating

11 Polytetrafluoroethylene (PTFE) pretreatment method for electroless plating

12 Liquid crystal polymer (LCP) pretreatment method for electroless plating

13 Conclusion and outlook

Key words: electroless plating, polymer, surface modification, coarsening, activation
Fig.1 Schematic flow diagram of the electroless plating process.
Fig.2 Schematic diagram of commonly used substrate materials and roughening and activation methods for electroless plating in the field of electronics. Roughening: chemical etching, grafting, plasma treatment; activation: ion exchange, ink printing, colloidal activation.
Fig.3 (a) Schematic diagram of conductive interconnection of PCB; (b) Schematic diagram of electromagnetic shielding layer prepared by electroless plating on a polymer substrate[50]; (c) Schematic representation of heat management by electroless plating of components with a layer of polymer insulation[39]
Fig.4 (a) Schematic diagram of graft modification process[4]; (b)Change of contact angle of samples after roughening[4]; (c) process of grafting; (d,e) Adhesive force test of tape pulling coating[36]
Fig.5 (a) Flow diagram of ion exchange activation[2]; (b) Glue stability test[1]; (c) Flow diagram of catalyst direct adsorption activation[53]
Fig.6 Schematic of catalyst adsorption electroless plating
Fig.7 (a) Structural formula of polyimide; (b) 100-square-knife test after electroless polyimide plating[47]; (c) bending test and conductivity change test after electroless polyimide plating[56] ; (d) Flow chart of ion exchange activation after chemical etching and roughening of polyimide[1]; (e) Flow chart of activation after chemical etching and grafting of polyimide[30]
Fig.8 (a) PET structural formula; (b) PET electroless plating after bending and conductive circuit test[59]; (c) Schematic diagram of direct adsorption and activation of Pd catalyst after PET roughening by plasma treatment[52]; (d) Conductive wire prepared by PET electroless plating device[72]
Table 1 Summary of commonly used methods for coarsening and activation of PI
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 VTMS 60 ℃/15 min PdCl2
NH4OH		 / 58
METAC 80 ℃/1 h
KPS
2 KOH 5 min AuCl3.3H2O

/		 56
PdCl2
CoCl2
AgNO3
CrCl3
3 KOH 5 min AgNO3 3 min 52
4 KOH 5 min NiCl2 5 min 2
5 KOH 5 min AgNO3 5 min 57
O Plasma treatment
Table 2 Summary of commonly used coarsening and activation methods for PET.
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 HCl ultrasound
5 min		 KH550 / 63
AgNO3
PVA
2 / / PM Print&
Plasma
treatment		 62,65,66
CH4N2S
AgNO3
BADGE
Hardener 593
3 Plasma
treatment		 / PdCl2 64
4 MPTES 2 h Cuf / 67
OAM
Paraffin
5 VTMS 15 min (NH4)2PdCl4 3min 53
METAC 80 ℃/60 min
MPTS
Fig.9 (a) PU structural formula; (b) electrode prepared by electroless plating on PU surface[71]; (c) PU conductive line as thin as 28 μm[71]; (d) elasticity test of PU sponge after electroless plating [24]; (e) PU conductive circuit test[79]; (f) PU surface electroless plating bending experiment [80]; (g) PU sponge electroless plating pretreatment flow chart[80]; (h) 3D printed PU and electroless plating samples[82].
Table 3 Summary of commonly used coarsening and activation methods for PU
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 NaOH 25 ℃/24 h AgNO3 25 ℃/1 h 23
Dopamine NH3·H2O
Tris·HCl
2 Tannic acid
KMnO4		 30 min (NH4)2PdCl4 15 min 69
SnCl2
3 H2SO4 / PdCl2 25 ℃/10 min 70
HCl
4 Na2S2O8 25 ℃/5 min PdSO4 10 min 72
H2SO4
5 H2CrO4 / SnCl2 15 min 71
H2SO4 HCl
AgNO3
6 Laser
irradiation		 1064 nm / / 22
7 KOH 50 ℃/2 h AgNO3 20 min 67
Laser
irradiation		 460 nm/3 minn
8 Chitosan 4 h PdCl2 10 min 23
NaH2PO2
9 METAC / (NH4)2PdCl 4 / 73
MPTS
Fig.10 (a) Structural formula of PDMS; (b) flow chart of Ag+ activation after PDMS graft modification with dopamine[78]; (c) Electroless plating pattern of PDMS precise and selective activation[16]
Fig.11 (a) PS structural formula; (b) SEM image of PS microspheres after electroless copper plating[85]; (c) (d) PS microspheres contacted with each other after hot pressing to form a conductive network[82]; (e) PS microspheres electroless plating and Flow chart of forming a three-dimensional conductive structure by hot pressing[82]
Table 4 Summary of common coarsening and activation methods for PDMS.
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 O Plasma treatment 10 s AgClO4 spin coating &
UV treatment		 79
MPA
Ma-P1215
2 SnCl2 45 min Ag(NH3)2NO3 10 min 76
C2HF3O2
3 APTES 24 h AgNO3 Write&
Plasma
treatment		 77
Tris-HCl
Dopamine
4 Alkanethiol 3 min PdNO3 / 15
HNO3
5 APTMS 12 h Ag(NH3)2NO3 / 80
APTES 30 min
6 APTES 3 h SnCl2 / 78
Fe3O4
Au
Table 5 Summary of common coarsening and activation methods for PS
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 PVP 70 ℃/12 h SnCl2 45 ℃/40 min 81
styrene monomer Na2SnO3
PdCl2
HCl
2 NaOH 5 min Pd/Sn / 82,84
3 H2SO4 40 ℃/4 h SnCl2 / 85
HCl
AgNO3
NH4OH
C4H4O6KNa
4 FeCl3·6H2O 24 h Ag/Sn / 83
Pyrrole-1-propionic acid
monomer
Pyrrole monomer
Table 6 Summary of commonly used coarsening and activation methods for PP
Method Roughening
reagent		 Roughening
conditions		 Activating
reagent		 Activation
conditions		 ref
1 DA-HCl 25 ℃/20 h HAuCl4 10 min 11
Tris-HCl
2 / Vacuum UV
treatment		 SnCl2 30 ℃/2 min 10
PdCl2
HCl
3 K2Cr2O7 15 min PdCl2 2 min 86
H2SO4 HCl
4 Py AgNO3 Print 13
5 TMS 10 min PdCl2 / 12
HCl
Fig.12 (a) Structure diagram of polypropylene; (b) Electroless plating on polypropylene surface to prepare electronic devices[13]; (c) Bending test of polypropylene after electroless plating[86]; (d) Polypropylene roughened by ultraviolet light under the mask, and then use the catalyst for direct adsorption activation to obtain a precise conductive pattern[11]
[1]
Sato T, Urata C. Mol. Cryst. Liq. Cryst., 2019, 688(1): 98.

doi: 10.1080/15421406.2019.1651074
[2]
Jones T D A, Ryspayeva A, Esfahani M N, Shuttleworth M P, Harris R A, Kay R W, Desmulliez M P Y, Marques-Hueso J. Surf. Coat. Technol., 2019, 360: 285.

doi: 10.1016/j.surfcoat.2019.01.023
[3]
Yang C, Li X T, Dong J, Zhao X, Gong J H, Zhang Q H. Acta Polymerica Sinica, 2022, 53(6): 663.
(杨晨, 李琇廷, 董杰, 赵昕, 龚静华, 张清华. 高分子学报, 2022, 53(6): 663.).
[4]
Zhu Y M, Tang J, Jin X, Pan T R, Chang Y, Yang Z G. ACS Appl. Mater. Interfaces, 2020, 12(6): 7679.

doi: 10.1021/acsami.9b17694
[5]
Yang S T, Kang Z X, Guo T. Nanotechnology, 2020, 31(19): 195710.

doi: 10.1088/1361-6528/ab703e
[6]
Sahoo S K, Sahu A K, Mahapatra S S. Int. J. Plast. Technol., 2017, 21(2): 297.

doi: 10.1007/s12588-017-9185-4
[7]
Jia Y K, Chen J X, Asahara H, Hsu Y I, Asoh T A, Uyama H. Polymer, 2020, 200: 122592.

doi: 10.1016/j.polymer.2020.122592
[8]
Chen Y. Int. J. Electrochem. Sci., 2021, 21112.
[9]
Kim K, Oh H, Kwon D, Lee J, Kim J. Compos. B Eng., 2019, 166: 742.

doi: 10.1016/j.compositesb.2019.02.065
[10]
Zhang W L, Ding D Y. Jnl Chin. Chemical Soc., 2016, 63(2): 222.

doi: 10.1002/jccs.v63.2
[11]
Li W L, Li L Y, Sun Q Q, Liu X Y, Kanehara M, Nakayama T, Jiu J T, Sakamoto K, Minari T. Chem. Eng. J., 2021, 416: 127644.

doi: 10.1016/j.cej.2020.127644
[12]
Chou S C, Sun B Y, Cheang W H, Tso K C, Fan T L, Chiao J C, Wu P W. Ceram. Int., 2021, 47(23): 32554.

doi: 10.1016/j.ceramint.2021.08.150
[13]
Yeetsorn R, Ouajai W P, Onyu K. RSC Adv., 2020, 10(41): 24330.

doi: 10.1039/D0RA00461H
[14]
Rao L H, Tang J Y, Hu S F, Shen L G, Xu Y C, Li R J, Lin H J. J. Colloid Interface Sci., 2020, 565: 546.

doi: 10.1016/j.jcis.2020.01.069
[15]
Qiang Q, Qin J X, Ma Y, Wang Z L, Zhao C. ACS Appl. Mater. Interfaces, 2019, 11(5): 5517.

doi: 10.1021/acsami.8b18209
[16]
Polywka A, Jakob T, Stegers L, Riedl T, Görrn P. Adv. Mater., 2015, 27(25): 3755.

doi: 10.1002/adma.v27.25
[17]
Mirmohammadi S M, Hoshian S, Jokinen V P, Franssila S. Sci. Rep., 2021, 11: 12646.

doi: 10.1038/s41598-021-92231-x pmid: 34135443
[18]
Adamo C B, Poppi R J, de Jesus D P. Microchem. J., 2021, 160: 105704.

doi: 10.1016/j.microc.2020.105704
[19]
Guo R S, Li H D, Wang H R, Zhao X Y, Yu H, Ye Q. ACS Appl. Mater. Interfaces, 2021, 13(47): 56597.

doi: 10.1021/acsami.1c18065
[20]
Oshikiri J, Kosuge A, Iimori Y, Watanabe M, Honma H, Takai O. Trans. Jpn. Inst. Electron. Packag., 2017, 10: E16.
[21]
Cheng P W, Chen C Y, Ichibayashi T, Chang T F M, Sone M, Nishimura S. J. Supercrit. Fluids, 2022, 180: 105455.

doi: 10.1016/j.supflu.2021.105455
[22]
Rytlewski P, Jagodziński B, Malinowski R, Budner B, Moraczewski K, Wojciechowska A, Augustyn P. Molecules, 2021, 26(18): 5571.

doi: 10.3390/molecules26185571
[23]
Xia S H, Wei C L, Tang J C, Yan J H. ACS Sustainable Chem. Eng., 2021, 9(42): 13999.

doi: 10.1021/acssuschemeng.1c05589
[24]
Lu J Y, Cheng W H, Shi Y Q, Jia P F, Liao C, Zhang K, Song L, Wang B B, Hu Y. J. Colloid Interface Sci., 2021, 603: 25.

doi: 10.1016/j.jcis.2021.06.103
[25]
Li Y, Chen Y, Yang Y, Gu J D, Ke K, Yin B, Yang M B. J. Mater. Chem. B, 2021, 9(42): 8801.

doi: 10.1039/d1tb01441b pmid: 34633022
[26]
Cheng J H, Gan G Y, Li J P, Yu X L, Tang L, Liu C B. Mater. Res. Express, 2021, 8(1): 015018.

doi: 10.1088/2053-1591/abd89c
[27]
Li Y R, Zheng W, Zhang A B, Xie Z Y, Liu M X. J. Alloys Compd., 2021, 870: 159368.

doi: 10.1016/j.jallcom.2021.159368
[28]
Kim S H, Bazin N, Shaw J I, Yoo J H, Worsley M A, Satcher J H, Sain J D, Kuntz J D, Kucheyev S O, Baumann T F, Hamza A V. ACS Appl. Mater. Interfaces, 2016, 8(50): 34706.

doi: 10.1021/acsami.6b12320
[29]
Jinsenji M, Tajiri A, Nishimura Y, Bachman M, Li G P, Takai O. J. Electrochem. Soc., 2019, 166(10): D470.

doi: 10.1149/2.0101912jes
[30]
Qiang Q, Geng X Y, Wang Z L. J. Adhesion Sci. Technol., 2019, 33(4): 371.

doi: 10.1080/01694243.2018.1507318
[31]
Huang S E, Shen F Y, Dow W P. J. Electrochem. Soc., 2019, 166(15): D843.

doi: 10.1149/2.1111915jes
[32]
Gao Q H, Wang M L, Chen J, Zhang M J, Zhao J C, Zhang M X, Hu J T, Wu G Z. RSC Adv., 2020, 10(26): 15139.

doi: 10.1039/D0RA02228D
[33]
Zhou M Q, Kang Z X, Zhu S M. Nanotechnology, 2019, 30(39): 395701.

doi: 10.1088/1361-6528/ab2a91
[34]
Kang Z X, Zhang Y, Zhou M Q. Chem. Eng. J., 2019, 368: 223.

doi: 10.1016/j.cej.2019.01.005
[35]
Liu T J, Sil M C, Chen C M. Compos. Sci. Technol., 2020, 193: 108135.

doi: 10.1016/j.compscitech.2020.108135
[36]
Zhang H, Kang Z X, Sang J, Hirahara H. Surf. Coat. Technol., 2018, 340: 8.

doi: 10.1016/j.surfcoat.2018.02.005
[37]
Asano T, Koshiba Y, Ueda Y, Nakagawa K, Yamanaka K, Mori M. Mol. Cryst. Liq. Cryst., 2007, 464(1): 187.
[38]
Chen L J, Wan C C, Wang Y Y. Journal of Colloid & Interface Science, 2006, 297(1): 143-150.
[39]
Lee C, Huang Y, Kuo L. Electrochemistry Communications, 2006, 8(6): 1021.

doi: 10.1016/j.elecom.2006.04.013
[40]
Biemolt J, van Noordenne D, Liu J W, Antonetti E, Leconte M, van Vliet S, Bliem R, Rothenberg G, Fu X Z, Yan N. ACS Appl. Nano Mater., 2020, 3(10): 10176.

doi: 10.1021/acsanm.0c02162
[41]
Taghavi Pourian Azar G, Fox D, Fedutik Y, Krishnan L, Cobley A J. Surf. Coat. Technol., 2020, 396: 125971.

doi: 10.1016/j.surfcoat.2020.125971
[42]
Liu C R, Pan L S, Li C H, Chen H R, Lee C L. J. Electrochem. Soc., 2015, 162(7): D283.

doi: 10.1149/2.0891507jes
[43]
Xie J Q, Ji Y Q, Kang J H, Sheng J L, Mao D S, Fu X Z, Sun R, Wong C P. Energy Environ. Sci., 2019, 12(1): 194.

doi: 10.1039/C8EE01979G
[44]
Ghosh S. Thin Solid Films, 2019, 669: 641.

doi: 10.1016/j.tsf.2018.11.016
[45]
Xu H R, Zhang J H, Feng J, Zhou T. Ind. Eng. Chem. Res., 2021, 60(24): 8821.

doi: 10.1021/acs.iecr.1c01668
[46]
Siau S, Vervaet A, Schacht E, Van Calster A. J. Electrochem. Soc., 2004, 151(2): C133.
[47]
Song J, Kim M R, Kim Y, Seo D, Ha K, Song T E, Lee W G, Lee Y, Kim K C, Ahn C W, Han H E. Nanotechnology, 2022, 33(6): 065303.

doi: 10.1088/1361-6528/ac353d
[48]
Liu H G, Feng Z S, Wang K, Lian J Q, Chen Y M, Yang M Y, Wang Y. J. Mater. Sci. Mater. Electron., 2022, 33(16): 13012.

doi: 10.1007/s10854-022-08243-4
[49]
Xing D, Lu L S, Xie Y X, Tang Y, Teh K S. Mater. Des., 2020, 185: 108227.

doi: 10.1016/j.matdes.2019.108227
[50]
Zhang N, Zhao R, He D Y, Ma Y Y, Qiu J, Jin C X, Wang C. J. Alloys Compd., 2019, 784: 244.

doi: 10.1016/j.jallcom.2018.12.341
[51]
Gebrael T, Li J Q, Gamboa A R, Ma J C, Schaadt J, Horowitz L, Pilawa-Podgurski R, Miljkovic N. Nat. Electron., 2022, 5(6): 394.

doi: 10.1038/s41928-022-00748-4
[52]
Lin F B, Li W, Du X D, Chen N L, Wu Y B, Tang Y S, Jiang J H. Appl. Surf. Sci., 2019, 493: 1.

doi: 10.1016/j.apsusc.2019.06.171
[53]
Zhang Y B, Zhang T, Shi H B, Liu Q, Wang T. Appl. Surf. Sci., 2021, 547: 149220.

doi: 10.1016/j.apsusc.2021.149220
[54]
Yang W Z, Liu Y, Xu W, Nie H Y. IEEE Sens. J., 2021, 21(9): 10473.

doi: 10.1109/JSEN.2021.3060281
[55]
Chen Y Q, Liu Y, Xu W, Zhang Y, Nie H Y. Surf. Topogr.: Metrol. Prop., 2020, 8(3): 035003.
[56]
Wang Y, Wang W, Ding X D, Yu D. Chem. Eng. J., 2020, 380: 122553.

doi: 10.1016/j.cej.2019.122553
[57]
Liu T J, Chen C H, Wu P Y, Lin C H, Chen C M. Langmuir, 2019, 35(22): 7212.

doi: 10.1021/acs.langmuir.9b00354
[58]
Wang Y F, Hong Y, Chen Q G, Zhou G Y, He W, Gao Z P, Zhou X, Zhang W H, Su X H, Sun R. J. Taiwan Inst. Chem. Eng., 2019, 97: 450.

doi: 10.1016/j.jtice.2019.02.014
[59]
Hussain N, Yousif M, Ali A, Mehdi M, Ullah S, Ullah A, Mahar F K, Kim I S. Mater. Chem. Phys., 2020, 255: 123614.

doi: 10.1016/j.matchemphys.2020.123614
[60]
Liu Q Z, Yi C, Chen J H, Xia M, Lu Y, Wang Y D, Liu X, Li M F, Liu K, Wang D. Compos. B Eng., 2021, 215: 108752.

doi: 10.1016/j.compositesb.2021.108752
[61]
Zhang Y B, Zhang T, Shi H B, Liu Q, Shi Y L, Wang T. ACS Sustainable Chem. Eng., 2021, 9(35): 11991.

doi: 10.1021/acssuschemeng.1c04613
[62]
Huang J J, Wu W P, Zhang R X, Lu G Q, Chen B, Chen Z M, Gui C M. Nano Energy, 2022, 92: 106734.

doi: 10.1016/j.nanoen.2021.106734
[63]
Chang Y, Yang C, Zheng X Y, Wang D Y, Yang Z G. ACS Appl. Mater. Interfaces, 2014, 6(2): 768.

doi: 10.1021/am405539r
[64]
Wang Y F, Hong Y, Zhou G Y, He W, Gao Z P, Wang S X, Wang C, Chen Y M, Weng Z S, Wang Y Q. ACS Appl. Mater. Interfaces, 2019, 11(47): 44811.

doi: 10.1021/acsami.9b11690
[65]
Liao Y, Kao Z. ACS Appl. Mater. Interfaces, 2012, 4(10): 5109.

doi: 10.1021/am301654j
[66]
Huang J J, Xu L L, Zhao D F, Wang J, Chu C R, Chen H D, Liu Y H, Chen Z M. Chem. Eng. J., 2020, 383: 123199.

doi: 10.1016/j.cej.2019.123199
[67]
Liu X Q, Guo R S, Shi Y X, Deng L B, Li Y. Macromol. Mater. Eng., 2016, 301(11): 1383.

doi: 10.1002/mame.v301.11
[68]
Liang S Q, Li Y Y, Zhou T J, Yang J B, Zhou X H, Zhu T P, Huang J Q, Zhu J L, Zhu D Y, Liu Y Z, He C X, Zhang J M, Zhou X C. Adv. Sci., 2017, 4(2): 1600313.

doi: 10.1002/advs.201600313
[69]
Zhu C, Chalmers E, Chen L M, Wang Y Q, Xu ben bin, Li Y, Liu X Q. Small, 2019, 15(35): 1902440.

doi: 10.1002/smll.v15.35
[70]
Li Y X, Liu Z, Jiang Y C, de Glee B, Li D Z, Zeng J H. J. Mater. Sci., 2018, 53(1): 479.

doi: 10.1007/s10853-017-1530-7
[71]
Fathi Dehkharghani A M, Divandari M. Trans. IMF, 2015, 93(4): 186.

doi: 10.1179/0020296715Z.000000000248
[72]
Han F, Su X Y, Huang M Q, Li J H, Zhang Y, Zhao S F, Liu F, Zhang B, Wang Y, Zhang G P, Sun R, Wong C P. J. Mater. Chem. C, 2018, 6(30): 8135.

doi: 10.1039/C8TC02413H
[73]
Yu Y, Zeng J F, Chen C J, Xie Z, Guo R S, Liu Z L, Zhou X C, Yang Y, Zheng Z J. Adv. Mater., 2014, 26(5): 810.

doi: 10.1002/adma.201303662
[74]
Ryspayeva A, David Arthur Jones T, Khan S R, Esfahani M N, Shuttleworth M P, Harris R A, Kay R W, Desmulliez M P Y, Marques-Hueso J. IEEE Access, 2019, 7: 104947.

doi: 10.1109/ACCESS.2019.2931594
[75]
Rytlewski P, Jagodziński B, Malinowski R, Budner B, Moraczewski K, Wojciechowska A, Augustyn P. Appl. Surf. Sci., 2020, 505: 144429.

doi: 10.1016/j.apsusc.2019.144429
[76]
Ding J L, Zhou P, Guo W L, Su B. Front. Chem., 2021, 8: 630246.

doi: 10.3389/fchem.2020.630246
[77]
Zhou B, Su B, Li M, Meng J H. J. Micromech. Microeng., 2020, 30(4): 045013.

doi: 10.1088/1361-6439/ab7263
[78]
Wu C Y, Tang X, Gan L, Li W F, Zhang J, Wang H, Qin Z Y, Zhang T, Zhou T T, Huang J, Xie C S, Zeng D W. ACS Appl. Mater. Interfaces, 2019, 11(22): 20535.

doi: 10.1021/acsami.9b05135
[79]
Ryspayeva A, Jones T D A, Esfahani M N, Shuttleworth M P, Harris R A, Kay R W, Desmulliez M P Y, Marques-Hueso J. Microelectron. Eng., 2019, 209: 35.

doi: 10.1016/j.mee.2019.03.001
[80]
Coulm J, LÉonard D, Desroches C, Bessueille F. Colloids Surf. A Physicochem. Eng. Aspects, 2015, 466: 75.

doi: 10.1016/j.colsurfa.2014.10.057
[81]
Li Y R, Zhang A B, Zheng W, Wang D, Kong J. J. Phys. Chem. C, 2020, 124(1): 1190.

doi: 10.1021/acs.jpcc.9b09892
[82]
Lee S H, Yu S, Shahzad F, Hong J, Noh S J, Kim W N, Hong S M, Koo C M. Compos. Sci. Technol., 2019, 182: 107778.

doi: 10.1016/j.compscitech.2019.107778
[83]
Wang C J, Hung P S, Chou S C, Chung W A, Wu P W. Mater. Lett., 2020, 263: 127239.

doi: 10.1016/j.matlet.2019.127239
[84]
Lee S H, Yu S, Shahzad F, Hong J P, Kim W N, Park C, Hong S M, Koo C M. Compos. Sci. Technol., 2017, 144: 57.

doi: 10.1016/j.compscitech.2017.03.016
[85]
Hu Y G, Zhao T, Zhu P L, Liang X W, Sun R, Wong C P. RSC Adv., 2015, 5(1): 58.

doi: 10.1039/C4RA12475H
[86]
Ali Fulazzaky M, Fulazzaky M, Sumeru K. J. Adhesion Sci. Technol., 2019, 33(13): 1438.

doi: 10.1080/01694243.2019.1602021
[87]
Liu Z D, Chen Z C, Li W, Ding Z K, Xu Z M. Heat Transf. Eng., 2021, 42(22): 1877.

doi: 10.1080/01457632.2020.1834202
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