| T(℃) | Concentration of KOH | Overpotential(mV) | Preparation methods | ref | |
|---|---|---|---|---|---|
| NiCu | Room temperature | 6 M | -370 | Electrodeposition | Sang et al.[ |
| Dense NiCu | 35 | 6 M | -500 | Arc fusion | Yu et al.[ |
| Sintered Porous Ni-Cu | 35 | 6 M | -400 | Powder metallurgy | Yu et al.[ |
| Metallurgical NiCu | 25 | 6 M (NaOH) | -300 | Powder metallurgy | Wang et al.[ |
| Smooth NiCo | 25 | 6 M | -380 | Electrodeposition | Fan et al.[ |
| NiCo | 25 | 6 M | -430 | Electrodeposition | Hong et al.[ |
| Ra-Ni from Al | 22 | 6 M | -115 | Pressing sintering | Brennecke et al.[ |
