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化学进展 2000, Vol. 12 Issue (01): 103- 前一篇   后一篇

• 综述与评论 •

超大规模集成电路硅片溶液清洗技术的进展

张树永;郭永榔;曹宝成;于新好   

  1. 山东大学化学学院 济南 250100；山东大学光电子材料与器件研究所及国家电子清洗技术研究推广中心 济南 250100
  • 收稿日期:1999-04-01 修回日期:1999-05-01 出版日期:2000-02-24 发布日期:2000-02-24
  • 通讯作者: 张树永
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Progress of Aqueous Solution Cleaning Technology for SiliconWafer in VLSICircuit Fabrication

Zhang Shuyong;Guo Yonglang;Cao Baoceng;Yu Xinhao   

  1. College of Chemistry, Shandong University, Jinan 250100, China ; National Research and Promotion Center of Electronic Device Cleaning Technology and Institution of Optoelectronic Materials and Devices,Shandong University, Jinan 250100, China
  • Received:1999-04-01 Revised:1999-05-01 Online:2000-02-24 Published:2000-02-24
  • Contact: Zhang Shuyong
本文综述了超大规模集成电路制造过程中硅片溶液清洗技术的研究历史及现状, 并对技术的未来发展进行了展望。
关键词： 集成电路, 硅片, 溶液清洗
The progress of the aqueous solution cleaning technology for silicon waferin very large scale integrated circuit fabrication is reviewed. The future of the aqueous solution cleaning technology is discussed as well.
Key words: integrated circuits, silicon wafers, aqueous solution cleaning.

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